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caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. hlmp-hd61, hlmp-hm61 and hlmp-hb61 precision optical performance red, green and blue 5mm standard oval leds data sheet description thesef precisionf opticalf performancef ovalf ledsf aref specifcallyfdesignedfforffullfcolor/videofandfpassengerf informationf signs.f f thef ovalf shapedf radiationf patternf andfhighfluminousfintensityfensurefthatfthesefdevicesf arefexcellentfforfwideffeldfoffviewfoutdoorfapplicationsf wherefafwidefviewingfanglefandfreadabilityfinfsunlightf arefessential.fftheseflampsfhavefveryfsmooth,fmatchedf radiationf patternsf ensuringf consistentf colorf mixingf inf fullf colorf applications,f messagef uniformityf acrossf thef viewingfanglefoffthefsign.ffhighfefciencyfledfmaterialf isfusedfinftheseflamps:faluminumfindiumfgalliumfphos - phidef(alingapfii)fforfredfandfindiumfgalliumfnitridefforf bluefandfgreen.ffeachflampfisfmadefwithfanfadvancedf opticalfgradefepoxyfoferingfsuperiorfhighftemperaturef andfhighfmoisturefresistancefinfoutdoorfapplications.f package dimensions notes: allfdimensionsfinfmillimetersf(inches). forfbluefandfgreenfiffheat-sinkingfapplicationfisfrequired,fthefterminalfforfheatfsinkfisfanode. features ? wellfdefnedfspatialfradiationfpattern ? highfbrightnessfmaterialf ? availablefinfred,fgreenfandfbluefcolor. f redfalingapf630mmf f greenfinganf525nm f bluefinganf470nmf ? superiorfresistanceftofmoisture ? standoffpackage applications ? fullfcolorfsigns ? commercialfoutdoorfadvertising. notes: 1.fmeasuredfatfbasefofflens cathodeflead 7.01 0.276 5.20 0.205 24.00fmin 0.945fmin 1.00fmin 0.039 2.5 4 0.1 0 3.80 0.150 0.70fmax . 0.028 1.500.15 0.0590.006 1.50fmax . 0.059fmax . 10.800.50 0.4250.020 0.500.10fsq. 0.0200.004
2 device selection guide part numbering system tolerancefforfeachfintensityflimitfisff15%. notes: 1.f thefluminousfintensityfisfmeasuredfonfthefmechanicalfaxisfofftheflampfpackage. packaging option zz:fflexifammo-packs color bin selection 0:f openfdistribution t:fredfcolor,fvffmaxf=2.6v maximum intensity bin 0:fnofmaximumfintensityflimit minimum intensity bin referftofdevicefselectionfguide. color b:fbluef470 d:fredf630 m:fgreenf525 package h:f5mmfstandardfovalf40?fxf100? ? hlmpf-fhfxf61f-fxfxfxffxfx part number color and dominant wavelength l d (nm) typ luminous intensity l v (mcd) at 20 ma min luminous intensity l v (mcd) at 20 ma max hlmp-hd61-txtzz redf630 800 1990 hlmp-hm61-y30zz greenf525 1990 5040 HLMP-HB61-QU0ZZ bluef470 460 1150
3 notes: 1.f forfoptionffCxxtxx,fthefvffmaximumfisf2.6v,freferftofvffbinftable 2.f thefdominantfwavelengthfisfderivedffromfthefchromaticityfdiagramfandfrepresentsfthefcolorfofftheflamp 3.f thefradiantfintensity,fi e finfwattsfperfsteradian,fmayfbeffoundffromfthefequationfi ef =fi v / vf wherefi v fisfthefluminousfintensityfinfcandelasfandf v f isfthefluminousfefcacyfinflumens/watt. 4.f forwardfvoltagefallowableftolerancefisff0.05v.f 5.f forfalingapfred,fthermalfresistancefappliedftofledfjunctionftofcathodeflead.fforfinganfbluefandfgreen,fthermalfresistancefappliedftofledf junctionftofanodeflead.f electrical / optical characteristics (t a = 25c) notes: 1.f derateflinearlyfasfshownfinffiguref2fandffiguref8.f 2.f dutyffactorf30%,ffrequencyf1khz. 3.f dutyffactorf10%,ffrequencyf1khz. absolute maximum rating (t a = 25c) parameter red blue and green unit dcfforwardfcurrentf [1] 50 30 ma peakfforwardfcurrent 100 [2] 100 [3] ma powerfdissipation 130 116 mw reversefvoltagef 5f(i r f=f100f m a) 5f(i r f=f10f m a) v ledfjunctionftemperature 130 110 c operatingftemperaturefrange -40ftof+100 -40ftof+85 c storageftemperaturefrange -40ftof+120 -40ftof+100 c parameter symbol min. typ. max. units test conditions forwardfvoltage fffffredf ffffffgreen ffffffblue v f 2.0 2.8 2.8 2.3 3.3 3.2 2.6 [1] 3.8 3.8 v i f f=f20fma reversefvoltage ffffffred ffffffgreenf&fblue v r 5 5 v i r f=f100f m a i r f=f10f m a dominantfwavelength ffffffred ffffffgreen ffffffblue l d 622 520 460 630 525 470 634 540 480 nm i ff =f20fma peakfwavelength ffffffred ffffffgreen ffffffblue l peak 639 516 464 nm peakfoffwavelengthfoffspectralfdistributionfatfi f f = f20f ma spectralfhalffwidth ffffffred ffffffgreen ffffffblue dl 1/2 17 32 23 nm wavelengthfwidthfatfspectralfdistributionf?fpowerf pointfatf,i ff =f20fma thermalfresistance, r q j-pin 240 c/w ledfjunction-to-pin luminousfefcacyf [3] f ffffffred ffffffgreen ffffffblue v 155 520 75 lm/w emittedfluminousfpower/emittedfradiantfpower
4 wavelengthfCfnm relativefintensity 1.0 0.5 0 600 700 650 550 0 40 20 i f f-fforwardfcurrentf-fma v f f-fforwardfvoltagef-fv 0 3.0 1.5 2.0 2.5 10 30 50 1.0 0.5 relativefintensity (normalizedfatf20fma) 0 0 forwardfcurrentf-fma 20 40 2.0 1.0 50 0.5 1.5 2.5 30 10 alingap red figure 1. relative intensity vs wavelength figure 2. maximum forward current vs ambient temperature figure 3. forward current vs forward voltage figure 4. relative intensity vsforward current 0 10 20 30 40 50 60 0 2 0 4 0 6 0 8 0 100 t a -fambientftemperaturef- o c i fffmax . -fmaximumfforwardfcurrentf-fma
5 wavelengthf-fnm relativefintensity 350 400 450 500 550 600 650 1.00 blue 0 0.80 0.60 0.40 0.20 green 0 5 10 15 20 25 30 35 0 2 4 forwardfvoltagef-fv forwardfcurrentf-fma 1 3 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 20 25 30 dcfforwardfcurrentf-fma relativefluminousfintensity (normalizedfatf20fma) 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 100 t a f-fambientftemperaturef-f o c i f f-fmaximumfforwardfcurrentf-fma ingan blue and green figure 5. relative intensity vs wavelength figure 6. forward current vs forward voltage figure 7. relative intensity vs forward current figure 8. maximum forward current vs ambient temperature
6 figure 9. relative dominant wavelength vs forward current figure 10. radiation pattern-major axis figure 11. radiation pattern-minor axis 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 3 0 6 0 9 0 angularfdisplacementf-fdegrees normalizedfintensity 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 3 0 6 0 9 0 angularfdisplacementf-fdegrees normalizedfintensity -4 -2 0 2 4 6 8 10 0 5 10 15 20 25 30 forwardfcurrentf-fma blue green relativefdominantfwavelenghtfshift (normalizedfatf20ma)
7 intensity bin limit table (1.2: 1 iv bin ratio) blue color bin table green color bin table vf bin table (v at 20ma) red color range tolerancefforfeachfbinflimitfisff0.5nm note:f 1.f allf binf categoriesf aref establishedf forf classifcationf off products.f productsfmayfnotfbefavailablefinfallfbinfcategories.fpleasefcontactf yourfavagofrepresentativefforffurtherfinformation. tolerancefforfeachfbinflimitfisff0.5nm tolerancefforfeachfbinflimitfisff0.5fnm tolerancefforfeachfbinflimitfisff0.05 tolerancefforfeachfbinflimitfisff15% bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 bin min dom max dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 min dom max dom xmin ymin xmax ymax 622 634 0.6904 0.3094 0.6945 0.2888 0.6726 0.3106 0.7135 0.2865 bin id min. max. va 2.0 2.2 vb 2.2 2.4 vc 2.4 2.6 bin intensity (mcd) at 20 ma min max q 460 550 r 550 660 s 660 800 t 800 960 u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040
8 avago color bin on cie 1931 chromaticity diagram relative light output vs. junction temperature 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -40 -20 0 2 0 4 0 6 0 8 0 100 t j f-fjunctionftemperaturef-f?c relativeflightfoutput (normalizedfatftjf=f25?c)f green blue red 0.000 0.200 0.400 0.600 0.800 1.000 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 x y 1 2 3 4 5 green red 3 4 5 blue 2 1
9 ? wavefsolderingfparameterfmustfbefsetfandfmaintainf accordingf tof recommendedf temperaturef andf dwellf timefinfthefsolderfwave.fcustomerfisfadvisedftofdailyf checkfonfthefsolderingfprofleftofensurefthefsolderingf proflefusedfisfalwaysfconformingftofrecommendedf solderingfcondition. note:f 1. f pcbfwithfdiferentfsizefandfdesignf(componentfdensity)fwillfhavef diferentfheatfmassf(heatfcapacity).fthisfmightfcausefafchangefinf temperaturefexperiencedfbyfthefboardfiffsamefwavefsolderingf settingfisfused.fso,fitfisfrecommendedftofre-calibratefthefsolder - ingfproflefagainfpriorftofloadingfafnewftypefoffpcb. 2. f avagof technologiesf highf brightnessf ledf aref usingf highf ef - ciencyfledfdiefwithfsinglefwirefbondfasfshownfbelow.fcustomerf isf advisedf tof takef extraf precautionf duringf wavef solderingf tof ensurefthatfthefmaximumfwaveftemperaturefisfnotfexceedingf recommendationfoff250ffc.fover-stressingfthefledfduringfsol - deringfprocessfmightfcausefprematureffailureftofthefledfdueftof delamination.f precautions lead forming: ? thefleadsfoffanfledflampfmayfbefpreformedforfcutf tof lengthf priorf tof insertionf andf solderingf intof pcf board. ? iffleadfformingfisfrequiredfbeforefsoldering,fcarefmustf bef takenf tof avoidf anyf excessivef mechanicalf stressf inducedf tof ledf package.f otherwise,f cutf thef leadsf off ledf tof lengthf afterf solderingf processf atf roomf temperature.fthefsolderfjointfformedfwillfabsorbfthef mechanicalfstressfoffthefleadfcuttingffromftravelingftof thefledfchipfdiefattachfandfwirebond. ? forfbetterfcontrol,fitfisfrecommendedftofusefproperf toolf tof preciselyf formf andf cutf thef leadsf tof lengthf ratherfthatfdoingfitfmanually. soldering condition: ? carefmustfbeftakenfduringfpcbfassemblyfandfsolder- ingfprocessftofpreventfdamageftofledfcomponent. ? thefclosestfmanualfsolderingfdistancefoffthefsolder - ingf heatf sourcef (solderingf ironsf tip)f tof thef bodyf isf 1.59mm.fsolderingfthefledfcloserfthanf1.59mmfmightf damagefthefled. led component lead size diagonal plated through hole diameter 0.457fxf0.457mm (0.018fxf0.018inch) 0.646fmm (0.025finch) 0.976ftof1.078fmm (0.038ftof0.042finch) 0.508fxf0.508mm (0.020fxf0.020inch) 0.718fmm (0.028finch) 1.049ftof1.150mm (0.041ftof0.045finch) wave soldering manual solder dipping pre-heatftemperature 105fcfmax. - preheatftime 30fsecfmax - peakftemperature 250fcfmax. 260fcfmax. dwellftime 3fsecfmax. 5fsecfmax note:freferftofapplicationfnotefan1027fforfmorefinformationf onfsolderingfledfcomponents. 1.59mm alingap device ingan device ? recommendedfsolderingfcondition: avago technologies led confguration note:felectricalfconnectionfbetweenfbottomfsurfacefoffledfdiefandf thefleadframefmaterialfthroughfconductivefpasteforfsolder. ? iffnecessary,fuseffxtureftofholdfthefledfcomponentf infproperforientationfwithfrespectftofthefpcbfduringf solderingfprocess.f note:finforderftoffurtherfassistfcustomerfinfdesigningfjigfaccuratelyf thatfftfavagoftechnologiesfproduct,f3dfmodelfoffthefproductfisf availablefuponfrequest. ? atfelevatedftemperature,fthefledfisfmorefsusceptiblef tofmechanicalfstress.ftherefore,fpcbfmustfbefallowedf tofcoolfdownftofroomftemperaturefpriorftofhandling,f whichfincludesfremovalfoffjigs,ffxturesforfpallet. ? specialfattentionfmustfbefgivenftofboardffabrication,f solderf masking,f surfacef platingf andf leadf holesf sizef andfcomponentforientationftofassurefsolderability.f ? recommendedfpcfboardfplatedfthroughfholesfsizefforf ledfcomponentfleads. ? overfsizingfoffplatedfthroughfholefcanfleadftoftwistingf orfimproperfledfplacementfduringfautofinsertion.fun - derfsizingfplatedfthroughfholefcanfleadftofmechanicalf stressfonfthefepoxyflensfduringfclinching
10 bottomfside topfsidef note:fallowfforfboardsftofbe conveyorfspeedf=f1.83fm/minf(6fft/min) 250 20 0 150 fluxing turbulentf wave preheat timef-fseconds temperaturef-f c 10 0 50 30 0 10 20 30 40 50 60 70 80 90 10 0 laminarf wave hotfairfknife leadffreefsolder 96.5%sn;f3.0%ag;f0.5%fcu sufficientlyfcooledfbefore exertingfmechanicalfforce. offpcfboard offpcfboard preheatfsettingf=f150 cf(10 0 cfpcb) solderfwaveftemperaturef=f245 cff5 c airfknifefairftemperaturef=f390 c airfknifefdistancef=f1.91fmmf(0.25fin.) solder:fsn63;fflux:frma airfknifefanglef=f40
packaging box for ammo packs ammo packs drawing note:fthefammo-packsfdrawingfisfapplicablefforfpackagingfoptionfCddf&f-fzzfandfregardlessfstandofforfnon-standof note:fforfinganfdevice,fthefammofpackfpackagingfboxfcontainfesdflogo
12 for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes av01-0418en av02-0339en - april 19, 2007 disclaimer:favagosfproductsfandfsoftwarefarefnotfspecificallyfdesigned,fmanufacturedf orfauthorizedfforfsalefasfparts,fcomponentsforfassembliesfforfthefplanning,fconstruction,f maintenanceforfdirectfoperationfoffafnuclearffacilityforfforfusefinfmedicalfdevicesforfappli - cations.ffcustomerfisfsolelyfresponsible,fandfwaivesfallfrightsftofmakefclaimsfagainstfavagof orfitsfsuppliers,fforfallfloss,fdamage,fexpenseforfliabilityfinfconnectionfwithfsuchfuse.

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